Samsung has achieved what it claims to be the industry’s highest light efficacies for its fillet-enhanced chip-scale package (FEC) LED lineup – LM101B, LH181B and LH231B.
Initially chip-scale package (CSP) LEDs had not been widely used in mainstream LED lighting markets due to relatively lower efficacy levels compared to conventional LED packages. However, the newly upgraded, efficacy-leading FECs can be applied to most mainstream LED lighting environments, including ambient, downlight, spotlight, high bay, canopy and street lighting applications.
The enhanced FEC LEDs are based on the company’s most up-to-date CSP technology which builds TiO (Titanium dioxide) walls around the side surfaces of the chip to direct light output upwards. The technology provides considerably higher light efficacy than conventional CSP LEDs while offering greater flexibility for luminaire designers.
Building on these advancements, the revamped FEC LED packages achieve the industry’s highest light efficacy levels, to suit an even wider range of lighting applications, the South Koran tech giant claimed. The mid-power CSP, LM101B, features an increased efficacy of 205 lm/W (65mA, CRI 80+, 5000K), which is the highest among 1W-class, mid-power CSP LEDs. The 3W-class LH181B provides the highest light efficacy in its class with 190lm/W (350mA, CRI 70+, 5000K) which represents a more than 10-percent enhancement over the previous version. The 5W-class LH231B package continues to offer 170lm/W (700mA, CRI 70+, 5000K), the industry’s highest efficacy for the 5W class, the world’s No. 1 NAND flash memory chip maker noted.
The world’s No. 1 NAND flash memory chip maker’s FEC lineup, now in mass production, is available in a full range of colour temperature (CCT) and colour rendering index (CRI) options. The Seoul-based tech major has confirmed that it will be showcasing its complete lineup at Light + Building 2018 in Frankfurt, Germany, March 18-23.